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Glass Through-hole Processing
High quality and precise glass through-hole -
Glass substrates for high frequency circuit boards
Circuit board with reduced transmission loss at higher frequencies -
Ceramics substrates with excellent heat dissipation
Ebinax’s plating technology maximizes the performance of semiconductor devices -
Plating onto Composite material (Heat sink)
Optimum plating process for surface condition and composition of materials -
3 Laser Metalization(3LM)
Further miniaturization and weight reduction of smart devices by LDS(Laser Direct Structuring)