Electromagnetic Shield Plating
Semiconductor module (left) and the plating sample (right)
By utilizing a plating film to reflect and attenuate electromagnetic waves, we can effectively safeguard electronic equipment from malfunctions.
Special Features
Applicable to complex shapes
We can plate electromagnetic wave shielding film uniformly onto the base material of complex shapes.
Ideal for prevention of “Intrasystem EMI”
In recent years, due to the high density of electronic components, the issue of mutual electromagnetic noise interference, or so-called “Intrasystem EMI” has arisen. Our electromagnetic shielding plating prevents Intrasystem EMI at the component level.
Enables devices to become smaller and lighter
Because the shield properties can be obtained with a thin film (about 10 µm), it can lead to size and weight reduction in electronic products.
Application Examples
IoT Device
parts
Wearable
Devices
Mobiledevice Parts
Tablets
PCs
＜＜ ”Our Technology”
