Gold-Tin Alloy Plating

Lead-Free Solder Bonding with a High Melting Point

Features of Gold-Tin Alloy

High Melting Point

Lead (Pb)-free

Corrosion Resistance/Shock Resistance

It can be used for a variety of applications, including as a layer for die bonding in super luminous LEDs and for the hermetic packages.

Features of Gold-Tin Alloy Plating

Plating onto fine and complicated shapes is possible by using photolithograph

Plating onto selective parts

Controllable gold-tin alloy thickness

Plating process

Example of Usage

Package Sealing Material

Please contact us if you have any questions.

[TEL] +81-3-3742-0107  [FAX] +81-3-3745-5476