Gold-Tin Alloy Plating
Lead-free Solder Bonding with a High Melting Point
Features of Gold-tin Alloy
High Melting Point
Lead(Pb)-free
Corrosion Resistance/Shock Resistance
It can be used for a variety of applications, including as a layer for die bonding in super-luminous LEDs and for hermetic packages.
Features of Gold-tin Alloy Plating
Plating onto fine and complicated shapes is possible by using photolithography
Plating onto selective parts
Controllable gold-tin alloy thickness
Au-Sn Plating Process
Example of Usage
Package Sealing Material
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