What are the design rules of the LDS wiring pattern?

In order to apply the LDS, you must match the shape of the sample to the design rules.

The design rules are as follows. Even if the result is not within the rule there are cases that correspondence is possible. Contact us.

L/S

Wiring width and wiring interval has two types, plane and curved surface.

In the case of plane

L/S≧120μm/120μm (Recommendation: L/S≧150μm/150μm)

平面のライン・アンド・スペース

In the case of curved surface

L/S≧150μm/150μm (Recommendation: L/S≧200μm/200μm)

曲面のライン・アンド・スペース

Radius

Pattern radius

R≧0.3mm (Recommendation: R≧0.5mm)

パターン半径

dge radius and Bend radius

R≧0.3mm (Recommendation: R≧0.5mm)

エッジ半径と曲げ半径

Distance from the edge

100μm and over

端部からの距離

The distance from the wall

300μm and over

壁からの距離

Extrusion pin

Distance from the pattern 0.2mm and overThe depth of the pin 40μm and under

押し出しピン

Parting line (PL)

It does not overlap with the pattern. (If it is not possible, please contact us.)

パーティング・ライン(PL)

Wiring formation for the dented part

The inclination of the side wall60 degrees and under

凹み部への配線形成

hrough-hole

Taper angle 60 degrees and under

スルホール

Aperture of the wiring

60 degrees and over

配線の開口部

Substrate

Ry=20μm and underThere are no burrs and scratches.

Capable of supporting thickness of the plating

Cu is required as an adhesion layer, and Ni is required to privent diffusion prevention of Cu and Au.

In the case of electroless plating

Cu 20μm + Ni 10μm + Au 0.5μm and under

In the case of electroplating

Cu 40μm + Ni 10μm + Au 0.5μm and under

Roughness after plating

Arithmetic average roughness Ra will be as follows.

In the case of electroless plating

Ra=3~10μm

In the case of electroplating

Ra=1~4μm

Please contact us if you have any questions.

[TEL] +81-3-3742-0107  [FAX] +81-3-3745-5476